IC Package
Engineering
Advanced facilities for IC Packaging
MMRFIC has expanded its capabilities with a 4,000 sq. ft. Class 10K clean room, designed for full system integration. This cutting-edge facility enables seamless execution of semiconductor packaging, system-in-package (SIP) solutions, PCB assembly, and comprehensive power-on and functional testing.
By maintaining a controlled environment with minimal particle contamination, we ensure the highest quality standards for industries including aerospace, industrial, and commercial electronics. Our expertise in semiconductor packaging enhances product performance, reliability, and miniaturization, making MMRFIC a trusted partner for advanced electronic solutions.
At MMRFIC, we utilize automated IT tools and technologies to
streamline every phase of the manufacturing process.
streamline every phase of the manufacturing process.
Our IC Packaging Services
Flip-Chip & Wire-Bonding Packaging
High-performance solutions for miniaturized semiconductor devices, offering superior electrical efficiency (flip-chip) and cost-effective die
connections (wire bonding).
Metal, Ceramic & Organic Substrates
Durable substrates enhancing thermal dissipation, mechanical strength, and electrical performance for demanding environments.
BGA, QFN, SIP, HMC, MCM & Custom Packages
Advanced packaging for compact, high-density integration, improving space efficiency and signal integrity.
Commercial, Industrial & Aerospace Packages
Reliable semiconductor packaging for commercial, industrial, and aerospace applications, meeting stringent durability standards.
Molded, Open Cavity & Hermetically Sealed Packages
Protective packaging solutions ensuring component longevity in harsh environmental conditions
Architecture & RTL Design
Our expertise covers system integration, architecture development, and RTL coding using VHDL, Verilog, and SystemVerilog for streamlined FPGA design.
Embedded Software & DSP
We develop embedded software for SoCs, leveraging soft and hard processor cores for DSP processing and FPGA-based algorithm implementation.
Testing & Verification
Our rigorous process includes test bench development, RTL verification, and post-synthesis simulation to ensure design accuracy and reliability.
Our IC Packaging & Integration Process
