Integrated IC Packaging
& Microelectronics
Assembly
0
+
sq. ft Clean Room
0
GHz
RF
Enabled Lab Support
0
K
10k
Class Clean Room
Leading Edge Infrastructure
IC Packaging
Microelectronics
Assembly
Functional Testing and Qualification
Supply Chain Management
Failure Analysis & Debug support
Thermal and Mechanical Design led Manufacturing
IC Packaging
Capacity
1M die attach per year.
Technology:
- BGA, LGA, QFN
- Wire Bond, Flip Chip, Stacked Die
- Air cavity package (for high frequency RF)
- Moulded packages
- Metal, Ceramic and
organic package - Miniaturization through
“3D System in Package” - Hermetically sealed
package (roadmap)
Microelectronics Assembly
Capacity
100K PCB’s (3K Components) per year
Technology:
- Class 2 & 3 assembly compliant to ISO AS9100D
- 25000 CPH Pick and Place Machine
- Solder Paste Jet Printing for selective assembly
- 10+3 zone Oven with Nitrogen to reduce Voids on thermal pads