PCB DESIGN
State-of-the-Art facility for
full system integration
MMRFIC has expanded its Electronics Manufacturing Services (EMS) capabilities with a 4,000 sq. ft. Class 10K clean room to deliver high-precision system integration. Our facility enables seamless semiconductor packaging, system-in-package (SIP) solutions, PCB assembly, power-on testing, and functional testing.
streamline every phase of the manufacturing process.
Our PCB Design Engineering Services
High-Volume PCB Assembly – 100K PCBs Per Year
We manufacture and assemble up to 100,000 PCBs annually, handling 3,000+ components per board to meet large-scale production demands with precision and efficiency.
Class 2 & 3 Assemblies – ISO AS9100D Compliant
Our assembly processes comply with ISO AS9100D standards, ensuring Class 2 & 3 assemblies that meet the high-reliability requirements of aerospace, industrial, and critical electronic applications.
High-Speed Pick & Place – 25,000 CPH
Our Pick and Place machine, operating at 25,000 components per hour (CPH), ensures fast, accurate, and automated component placement for high-efficiency production.
Solder Paste Jet Printing for Selective Assembly
We use solder paste jet printing to enable precise, contact-free solder application, improving assembly quality and reducing defects in selective soldering areas.
10+3 Zone Reflow Oven with Nitrogen
Our 10+3 zone reflow oven uses nitrogen-assisted soldering to minimize voids on thermal pads, enhancing thermal management and component longevity.
